Analysis&Measurement / Kelvinion Chip

Kelvinion Chip · Temperature Sensors

Precise Temperature Sensing for Extreme Environments

Resistive Temperature Sensors Operable in Ultra-Low Temperature, High Magnetic Field, and Ultra-High Vacuum Environments

Cryogenic Compatible

100 mK

Precise Resistance Control

Ultra-Low Magnetoresistance

0.5 %

1.8 K, 14 T Magnetic Field

Exceptional Thermal Shock Resistance

10 k

200 K Repeated Thermal Shock Test

Key Parameters

Leading the Industry

Wide Range

Models for 0.1 to 420 K

High Field Compatible

Low Magnetoresistance, Accurate Temperature Sensing in Strong Magnetic Fields

High Reliability

Over 10,000 Room-Temperature to Liquid Nitrogen Thermal Cycles

Kelvinion Chip Thermometer Specifications

KChip

KChip.LT

KChip.ULT

➨  Model

➨  Sensing Parameters

1    Calibrated Temperature

      Range

Minimum Temperature

Maximum Temperatur

1.4 K

420 K

0.3 K

420 K

0.1 K

420 K

2    Sensor Type

NTC RTD

3    Resistance 1

@300 K 50 Ω

@1.4 K 10 kΩ

@300 K 40 Ω

@1.4 K 2 kΩ

@300 mK10 kΩ

@300 K 30 Ω

@1.4 K 1k Ω

@300 mK5 kΩ

@100 mK10 kΩ

4    Sensitivity 12

@4.2K

@300K

-500 Ω/K

-0.35 Ω/K

-150 Ω/K

-0.2 Ω/K

-25 Ω/K

-0.08 Ω/K

5    Accuracy 13

@4.2K

@300K

5 mK

60 mK

6    Resolution 14

@4.2K

@300K

8 μK

0.37 mK

26 μK

0.65 mK

52 μK

1.6 mK

7    Magnetically Induced

     Temperature Drift 15 @12 T

@1.8K

@77K

@300K

< 0.5 % ( < 9 mK )

< 0.08 % ( <67 mK )

< 0.05 % ( <140 mK )

< 0.5 % ( < 9 mK )

< 0.08 % ( <67 mK )

< 0.05 % ( <140 mK )

< 0.5 % ( < 9 mK )

< 0.08 % ( <67 mK )

< 0.05 % ( <140 mK )

8    Heating Power1, 6

100 pW @1.4 K

10 fW @0.3 K

10 fW @0.1 K

9    Thermal Shock Tes

10,000 次以上

➨  Basic Information

10    Packaging

SD CUAA & BG

11    Sensor Magnetism

Non-Magnetic Materials & Package

12    Sensor Materials

Oxide Semiconductor Materials

13    Operating Environment

Radiation Environment 7

UHV 8

Compatible

Compatible

14    Verification

RoHS

  1. Typical Values
  2. Sensitivity, κ: κ=dR/dT, the sensitivity represents the relative change of resistance with temperature at the current temperature. A larger absolute value of sensitivity indicates the thermometer is more responsive to temperature changes
  3. Calibration Accuracy, dT: The error between the thermometer’s measured temperature (T) and the reference standard temperature (TR), dT = | T – TR |
  4. Resolution: The smallest temperature change measurable under specific conditions. Measured using Kelvinion Ultra, with excitation voltage set to 2 mV
  5. Magnetically Induced Temperature Drift, dT/T : The relative change of thermometer temperature under a magnetic field compared to zero-field, dT/T = ( TH-T0 ) / T0, where TH s the thermometer temperature in the magnetic field, T0 is the temperature at zero field. The drift is mainly caused by the magnetoresistance effect of the thermometer; Magneto-resistance,dR/R = ( RH-R0 )/R0, where RH is the sensor resistance in a magnetic field, and R0 is the sensor resistance at zero field. Smaller magneto-resistance indicates stronger tolerance of the sensor to magnetic fields
  6. Heating Power : The Joule power generated by the excitation current flowing through the thermometer during resistance measurement. Measured using Kelvinion Ultra, with excitation current set to 100 nA (KChip) and 1 nA (KChip.LT & KChip.ULT). 1 pW = 10-12 W, 1 fW = 10-15 W
  7. Radiation Environment: Using Co-60 as a γ-ray source at room temperature, with a dose rate of 40 Gy/min to accumulate a total dose of 10,000 Gy
  8. Ultra-high Vacuum Environment, UHV: Ultra-high vacuum with pressure below 10-5 Pa

Packaging

Various Packaging Options
for Versatile Installation

SD, CU, AA, and More…

➨  Packaging: All metal parts and cables are non-magnetic by design

Dimensions

KChip.SD

3.2 mm X 1.9 mm X 1.0 mm

( Length × Width × Thickness )

1    SD Package

      ( Kelvinion Chip )

Weight

Materials

Wiring

Maximum Operating Temperature

40 mg

Sapphire Substrate, Alumina Ceramic Case ( Fully Non-Magnetic )

Gold-Plated Copper Wires ( Fully Non-Magnetic )

420 K

Dimensions

KChip.CU

Φ7.95 mm X 4.35 mm

( Diameter × Thickness )

2    CU Package

      ( Kelvinion Chip )

Weight

Materials

Wiring

Maximum Operating Temperature

1.1 g ( Excluding Wirings )

Gold-Plated OFC ( Fully Non-Magnetic )

36 AWG Quad-Twisted Phosphor Bronze, 1 m ( Default )

420 K

Dimensions

KChip.AA

Φ3.0 mm X 8.5 mm

( Diameter × Thickness )

3    AA Package

      ( Kelvinion Chip )

Weight

Materials

Wiring

Maximum Operating Temperature

0.36 g ( Excluding Wirings )

Gold-Plated OFC ( Fully Non-Magnetic )

36 AWG Quad-Twisted Phosphor Bronze, 1 m ( Default )

420 K

Dimensions

KChip.BG

1.0 mm X 1.0 mm X 0.2 mm

( Length × Width × Thickness )

4    BG Package

      ( Kelvinion Chip )

Weight

Materials

Wiring

Maximum Operating Temperature

< 3.0 mg

Sapphire Substrate, Back Gold-Plated ( Fully Non-Magnetic )

50 μm Gold Wire, 25 mm ( Default )

420 K

Product Data

Down.List

Product Declarations

2D / 3D file

Kelvinion Manual

.pdf

Consultation Purchase

Contact us

  • info@multifields.com
  • Building 2, Nonferrous Metals New Materials Science Park, Huairou Science City, Huairou District, Beijing